DoW and NIST Funding of $7.5M Accelerates Laser Thermal's Leadership in Metrology
$7.5M
Non-dilutive funding awarded
As thermal scientists at the University of Virginia, Dr. John Gaskins and Dr. Patrick Hopkins understood the difficulty in obtaining fast, accurate, and reliable thermal metrology data, especially from thin films and complex structures. To address this need, they founded Laser Thermal to deliver user-friendly solutions for measuring thermal conductivity, resistance, and volumetric heat capacity across a wide range of materials and length scales.
With limited time to devote to proposal development alongside ongoing R&D—and little familiarity with the SBIR/STTR process—Laser Thermal turned to EGC in 2022 for guidance on its first SBIR proposal.
Since then, EGC has partnered with Laser Thermal to secure seven competitive SBIR/STTR awards totaling approximately $7.5 million, including multiple DoW awards through DARPA and the U.S. Air Force, as well as funding from the CHIPS for America Metrology SBIR Program at NIST.
This support has propelled Laser Thermal to scale as a leader in advanced thermal metrology, designing and manufacturing precision instruments for semiconductor companies, research institutions, and government partners.
“EGC has been an invaluable partner in helping Laser Thermal secure highly competitive funding that accelerates our ability to bring advanced thermal metrology to industry. Their expertise in aligning our technology with agency priorities has directly supported our growth and impact across semiconductors, power electronics, and beyond.”
-John Gaskins, CEO, Laser Thermal
Funding Sources
